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Communication chip/module Description

Communication chip/module products

Three-Phase Dual Mode


· Support G3-PLC standards

· Highly linearity and Liner Driver (V6000)with gathering receiver

· Support bandplan: CENELEC A, FCC, ARIB and G3M mode(up to 2MHz)

· Support modulations: selectable differential or coherent DBPSK/BPSK, DQPSK/QPSK, D8PSK/8PSK 

· Support IPv6 networking layer

· Support G3-PLC compliant with 6LWPAN adaption layer and optimized networking and mesh routing function

· Up to 32 programmable GPIOs

· 2MB Flash, 128kB SRAM memory

· Integrated LDO

Wireless Communication  

· Bandplan: 902~928MHz

· Receiving sensitivity: -103 dBm @50kbps

· Signal interference characteristics: 86dB at 10MHz

· Nearly channel selectable: up to 60dB at 12.5-kHz offset 

· Support modulations: 2-FSK, 2-GFSK,4-FSK, 4GFSK, MSK, OOK

· Phase Noise: -114dBc/Hz at 10-kHz Offset (169MHz) 

· Fulfill 802.15.4g package: CRC 16/32, FEC, Dual Sync Detection (FEC and non-FEC, Whitening)


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